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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)

Name: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)
Price: 541.89 ANG
Availability: InStock
Rating: 4.5 (1 reviews)

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Product ID: 521494379

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3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility (IEEE Press)

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The delivery time was excellent, and the packaging was secure.

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The product exactly matches the description. Very satisfied with my purchase.

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